Staff Profile

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Dr. Soon Kok Heng

Head of Department – Mechanical Engineering, Senior Lecturer
MSc (QUB), PhD (QUB), CEng (ECUK), MIMechE

Faculty of Engineering, Computing and Science

Office No:+60 82 260 740
Fax No:+60 82 260 813
Room No: E205, Building E, FECS
Email: khsoon@swinburne.edu.my
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Dr. Kok Heng Soon obtained his Advanced Diploma in Mechanical and Manufacturing Engineering in 2005, Master of Science in Manufacturing Systems Engineering with research emphasis on fused deposition modelling for tissue scaffold in 2006, and Doctor of Philosophy in Mechanical Engineering in 2010 at the Queen’s University of Belfast, UK. His Ph.D. dissertation topic was on processing-morphology-properties of biaxially deformed polymer nanocomposites. He joined Swinburne University of Technology, Sarawak as a Lecturer in the Faculty of Engineering, Computing, and Science in September 2011, and was subsequently promoted to Senior Lecturer in 2014.

His research interests include computational mechanics (Finite Element Method), processing, structure and properties of polymer and composites, green chemistry, semiconductor materials, and learning and teaching (blended learning and using of technological tools in engaging students).

Research Interests

  • Computational mechanics (Finite Element Method) for semiconductor materials and polymer composites;
  • Processing, structure and properties of polymer and composites;
  • Green chemistry and material science;
  • Learning and teaching (blended learning and using of technological tools in engaging students

Professional Memberships

  • Professional Technologist, Malaysia Board of Technologists (MBOT)
  • Chartered Engineer and Member, Institution of Mechanical Engineers, UK

PhD/Master by Research Opportunities

Potential research higher degree candidates are welcome to enquire about postgraduate opportunities in the areas listed above. Please e-mail khsoon@swinburne.edu.my for more information.


  • 2019 SoR Research Success Awards. 2019 HDR Supervision Success Recipients. 2019 Publication Success Recipients.
  • ‘Best of Session’ award at the International Microelectronics Assembly and Packaging Society (IMAPS) Annual Symposium, 10 to 12 October 2017, held in Raleigh, North Calorina, United States. ‘Reduction of Thermal Stress – Part I: Passivation Thickness Optimisation of Standard Bump Design.’
  • Gold Medal Award, Innovation technology Expo 2017 (InTex17), 17&18 May 2017, held at the Universiti Malaysia Sarawak (UNIMAS), ‘Analysis of Dielectric Properties of Natural Fiber Composites for Electronics Industries’.
  • Gold Medal Award, Innovation technology Expo 2017 (InTex17), 17&18 May 2017, held at the Universiti Malaysia Sarawak (UNIMAS), ‘From waste to wealth: An integration of Biotechnology in Materials Engineering’.

Research Grants

Strategic Research Grant 2021, Swinburne University of Technology Sarawak
Title: Extraction and characterisation of nanocrystalline cellulose from agricultural wastes, and its utilisation in forming biodegradable plastic composites

Learning and Teaching Grant 2021, Swinburne University of Technology Sarawak
Title: Assessing Student Competencies through Flipped Open-ended Laboratory

Fundamental Research Grant Scheme (FRGS) 2019, Ministry of Education Malaysia
Title: A Study of the Effect of Increased Hydrophobicity via Free Radical Graft Polymerization Produced through Microwave Irradiation on the Interfacial Enhancement of Wood Polymer Composites

Swinburne Sarawak Research Grant 2016, Swinburne University of Technology Sarawak
Title: Development of Biocomposites Bone Plates for Biomedical Applications Derived from Renewable Resources

Fundamental Research Grant Scheme (FRGS) 2013, Ministry of Education Malaysia
Title: Development of Sustainable Biodegradable Polymer Composites Reinforced with Locally Available Natural Fibres


Kamran, M.K., Jayamani, K., Soon, K.H., Wong, Y.C. (2021) ‘Comparison of Chemically Treated Luffa cylindrica Using Fourier Transform Infrared Spectroscopy (FTIR) and Thermal Analysis’, Materials Science Forum Online: 2021-05-13, Vol. 1030, pp 53-62

Mane, S.S., Soon, K.H., Bergmann, L., Erstling, M., Jayamani, E., Patra, J. (2021) ‘Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices’, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 8, pp. 1258-1266, Aug. 2021, doi: 10.1109/TCPMT.2021.3100100.

Kamran, M.J., Jayamani, E., Heng, S.K., Wong, Y.C. (2021) ‘A review: Surface treatments, production techniques, mechanical properties and characteristics of Luffa cylindrica bio composites’, Journal of Industrial Textiles doi:10.1177/1528083720984094

Mane, S.S., Sethu, R.S, Bergmann, L., Erstling, M., Soon, K.H. (2019), ‘A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing’, Microelectronics Reliability, Volumes 100–101, September 2019, 113333 https://doi.org/10.1016/j.microrel.2019.06.025